EVG is an Austrian manufacturer of wafer bonding and lithography equipment, and the EVG500 series recently introduced a new wafer bonding system. The EVG520L3 system includes three chambers that combine the advantages of temperature control, piston force uniformity and modularity in this series of devices. The concept of this cavity combination meets the need for high vacuum. The company said that the CMOS-compatible bonding process will significantly increase throughput, cost of ownership and yield. EVG senior technical director Paul Lindner said that the EVG520L3 is a next-generation wafer bonding device developed on the basis of feedback from customers. It brings together the results of EVG's many years of development. The design of the cavity is relatively stable and the component replacement is small; the bond module is fully matched to the EVG540 single cavity and Gemini integrated wafer bonding system. Furthermore, bond chucks are also matched to Gemini and EVG600 series aligners. This helps customers speed up time-to-market and reduce the cost of ownership of wafer bonding processes. In the actual process, the three cavities are paralleled to achieve uniform quality and uniformity. The simultaneous stacking of three substrate wafers means that the EVG520L3 needs to be compatible with wafers of various materials. This design concept is relatively novel, including the use of front and rear bonding processes, baking and gas supply and supply separation, high vacuum operating environment, pre-bond cooling, and faster bonding time (high vacuum environment is three times the original, The ultra-high vacuum is 5.5 times the original).
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