Recently, as the progress of the semiconductor process shrinks gradually slows down and observes future industry trends, Walden C. Rhines, director and CEO of Mentor Graphics, said that in the next 10 years, process shrinkage will encounter economic benefits. In consideration, the semiconductor industry will no longer fully follow Moore's Law (Moore, s Law) development. He also pointed out that the development of 3D IC is the continuation of the growth momentum of the semiconductor industry. Yan Huade believes that Moore's Law is an industry trend from observation and is not a constant law, and Gordon Moore, the author of Moore's Law, has also amended this law in recent years. Yan Huade said that Moore's Law is a learning curve, as long as the production scale of the product continues to increase, and the cost will decline. In the past 10 years, the number of transistors produced by the semiconductor industry has grown by 49% per year, and the number of chips shipped has increased by 13% every year. Therefore, the price of chips has gradually declined to the most recent reaction. According to Moore's Law, the number of integrated transistors on a chip doubles every 18 to 24 months. However, Yan Huade believes that with the continuous advancement of technology, the current process shrinkage is not the only solution to integrate more transistors in a single chip package. For example, the 3D IC will be a semiconductor technology that can be compared to process miniaturization in the next 10 years. In recent years, Mentor has been betting on a large number of R&D resources on 3D ICs. Currently, memory operators have used related solutions to introduce TSV processes into the production process. However, Hua Huade said that the application of this technology still faces challenges in the logic process, including related electromagnetic interference analysis. However, Yan Huade pointed out that these tools are currently available in the current Electronic Design Automation (EDA) environment, and suppliers only need to make improvements based on the characteristics of 3D ICs. If future chip design customers increase their demand for 3D ICs, it is expected that the relevant EDA industry will propose solutions, so the dilemma is not an intractable problem. 4.2mm Pitch 4.2mm Pitch ATKCONN ELECTRONICS CO., LTD , https://www.atkconn.com